Probe Card

Product

The Probe Card is an important piece of equipment used in the testing process of semiconductor chips, and is used to test individual chips on semiconductor wafers. It is primarily used in wafer-level testing, and is a tool for identifying electrical properties before a chip is packaged.

Probe Card Design Responsible Work

(Classification by task)

No Assortment Category Work Result File Format
1-1 New
Review
Review of
Development
possibilities
Verify Probe array and Head configuration Probe Array Drawings Auto CAD
1-2 Create a TD Map and determine the number of Para TD MAP(Shared Map) Excel
1-3 Channel Assign Channel Assign Sheet Excel
1-4 Creating a Block Diagram and Configuring a Circuit Net list Excel
1-5 MLC Confirms PCB Expected Layer Stack up Excel
2-1 Circuit
Design
MLC Design
(Layout)
Top and Bottom Thin Film Design
(Tip, LGA, Part Arrangement)
MLC Thin Film Drawings Auto CAD
2-2 MLC Inner Layer Design MLC Inner Layer drawing Allegro
2-3 PCB Design
(Layout)
Placement of parts and check availability PCB Layout drawing Auto CAD
2-4 PCB Inner Layer Design PCB Inner Layer drawing Allegro
3-1 Circuit Analysis Signal Integrity TPD Analysis and Selection Seletion of TPD Target and Wiring Length Excel
3-2 Insertion Loss, Eye Open, X-Talk Simulation result Touchstone File
3-3 Power Integrity PDN, IR DROP Simulation result Touchstone File

Probe Card Design Responsible Work

(Classification by Product)

Assortment Device Circuit
MLC PCB MLO Checker Board Simulation
Memory Nand Flash [EDS/WFB]
DRAM [EDS/WFB]
HBM
CIS
Non Memory SSD Controller
SoC
DDI
SMART IC

Memory

NAND : EDS, WFBI MEMS Type 100 or more
NAND : EDS, WFBI MEMS Type 50 or more
HBM : Experience in EDS design and implementation of relevant tasks

Non-Memory

CIS : Canti, MEMS Type 150 or more design
DDI : Canti Type 50 or more design
SOC : Vertical Type 30 or more design